We manufacture spin etcher and spin cleaner

We make the most of our spin control technology to manufacture spin etcher, spin cleaner and spin dryer.

Spin cleaner
A spin cleaner removes invisible small particles, oil and other contaminants from the top surface of substrates.
In many cases, we receive orders for substrate cleaning applications for semiconductor equipment.
We can produce customized models that combine various functions such as single wafer or badge style, explosion proof mechanism, and ultrasonic cleaning.


Spin dryer
A spin dryer utilizes the centrifugal force of rotation and airflow to promote drying. We can also manufacture the integrated spin cleaner and dryer model, especially for semiconductor device substrates that require delicate handling.

Spin etcher
A spin etcher uses solution droplets to corrode and peel away excess thin film, except for the necessary circuitry exposed in the pre-processing stage, primarily in semiconductor manufacturing.

As with the customization of spin coaters, we customize the size and specifications of the above devices to meet your needs. For example, the device can be rotated in a nitrogen gas atmosphere to prevent oxidation, and various types of solutions can be automatically dripped. We have a wealth of experience in manufacturing spinning products, and we are happy to provide advice and other services to meet your application needs. Please do not hesitate to contact us.
Customers
● Public organization (research institute and technology center)
● Educational institutions
● Research institute and R&D center of private companies
● Electronic manufacturer, chemical corporation, printing corporation and iron manufacturer

Past Products

W-1: Single-wafer spin cleaner
スピンエッチング装置・スピン洗浄機・スピン乾燥機
  • Spin cleaner
Feature
● Spin cleaner with automatic swing arm, micro syringe pump and precisive dripping feature
Substrate size
φ10-200 inch (Max. φ 8 inch, □200mm)
AC100V Max.6000rpm
Dimension
740w×740d×935h (ACT-400AⅡSW)
W-2: Explosion-proof desktop spin cleaner
スピンエッチング装置・スピン洗浄機・スピン乾燥機
(モーター部N2パージ+電装部セパレート方式)
  • スピン洗浄機(乾燥機)
特徴
3液の自動滴下 薬液ノズル 1:アセトン 2:IPA 3:純水
セレクトスイッチ手動操作滴下簡易ドラフト設置
基板サイズ
Max.Φ6インチウエハー及び□100mmガラス基板
AC100V Max.5000rpm
SIZE
スピンコーター本体 350W×350D×312H
操作ボックス 360W×300D×200H
卓上型透明塩ビドラフト:600W×500D×1000H (ACT-300AS)
W-3: Spin Dryer
スピンエッチング装置・スピン洗浄機・スピン乾燥機
  • Spin cleaner (dryer)
  • Desktop type
  • Single-wafer style
Features
The wetted part is made of PVC or PP.
Air joint at the center of cover enables the cup to be filled with nitrogen.
ubstrate size
Max.φ6 inch (wafer) and □100mm (glass)
AC100V Max.6000rpm
Dimension
500W×686D×400H (ACT-400WⅡS)
W-4: Spin cleaner
スピンエッチング装置・スピン洗浄機・スピン乾燥機
  • Spin cleaner (dryer)
  • Desktop type
  • Single-wafer style
  • Automatic dripping unit
Dripping unit with automatic swing arm by pressurized tank
Features
The wetted part is made of PVC or PP.
Pressurized tank provides pure water to conduct the rinse cleansing of substrate surface.
Substrate size
Max.φ6 inch (wafer) and □100mm (glass)
AC100V Max.5000rpm
Dimension
410W×600D×500H (ACT-300WS)
W-5: Spin dryer
スピンエッチング装置・スピン洗浄機・スピン乾燥機
  • Spin dryer
  • Desktop type
  • Single-wafer style
Features
The wetted part is made of PVC or PP.
Waste liquid port is provided in the back side.
Substrate size
Max.φ6 inch (wafer) and □100mm (glass)
AC100V Max.5000rpm
Dimension
350W×405D×400H (ACT-300AⅡDry)
W-6: Spin cleaner (dryer)
スピンエッチング装置・スピン洗浄機・スピン乾燥機
  • Spin cleaner (dryer)
  • Desktop type
  • Single-wafer style
Features
Spin cleaning is automatically performed while dripping a specified chemical solution.
Wetted parts are made of PP.
Mechanical chuck is employed.
Liquid wastes can be separated into the tank.
Controlled by touch panel
Substrate size
Max.φ8 inch (wafer) and □150mm (glass)
Three-phase AC 200V Max.5000rpm
Dimensio
1200W×900D×2000H (ACT-400AWS)
W-7: Cleaning nozzle
スピンエッチング装置・スピン洗浄機・スピン乾燥機
  • Dripping unit by pure water
Available nozzles
1. Hydrofluoric acid or pure water + ultrasound
2. IPA
3. Acetone
4. Nitrogen gas
W-8: Spin etcher for φ8 inch substrate with back rinsing function
スピンエッチング装置・スピン洗浄機・スピン乾燥機
  • Spin cleaner (dryer)
  • Automatic dripping unit
Features
Etch rinsing is performed as rinse nozzle is automatically controlled.
Substrate size
Max. φ12 inch
Three-phase AC 200V Max.3000rpm
Dimension
850W×1000D×1300H (ACT-500AⅡ)